Difference between revisions of "General Meeting Summary 12/17/20"
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(Created page with "PARTCIPANTS: A. Brown, A. Camsonne, B. Wojtsekhowski, B. Sawatzky, C. Munoz-Camacho, C. Yeros, R. Ent, H. Mkrtchyan, P. Medeiros, S. Lassiter, S. Wood, V. Tadevosyan, V. Berdn...") |
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PARTCIPANTS: A. Brown, A. Camsonne, B. Wojtsekhowski, B. Sawatzky, C. Munoz-Camacho, C. Yeros, R. Ent, H. Mkrtchyan, P. Medeiros, S. Lassiter, S. Wood, V. Tadevosyan, V. Berdnikov, M. Boer, C. Hyde, H. Voskanyan | PARTCIPANTS: A. Brown, A. Camsonne, B. Wojtsekhowski, B. Sawatzky, C. Munoz-Camacho, C. Yeros, R. Ent, H. Mkrtchyan, P. Medeiros, S. Lassiter, S. Wood, V. Tadevosyan, V. Berdnikov, M. Boer, C. Hyde, H. Voskanyan | ||
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'''FRAME''' (Carlos) | '''FRAME''' (Carlos) | ||
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* During crystal stacking PCBs can be inside or outside the box | * During crystal stacking PCBs can be inside or outside the box | ||
| − | * '''Action' | + | * '''Action''': |
::* check on access to holes to secure the box to the rails | ::* check on access to holes to secure the box to the rails | ||
::* pressure check on frame before any crytal stacking etc. (S. Lassiter) | ::* pressure check on frame before any crytal stacking etc. (S. Lassiter) | ||
| Line 28: | Line 29: | ||
::* interlocks on various things to protect the system, e.g. temperature (T>18degC), humidity (>40%) | ::* interlocks on various things to protect the system, e.g. temperature (T>18degC), humidity (>40%) | ||
| − | * '''Actions' | + | * '''Actions''' |
::* humidity sensor cables access | ::* humidity sensor cables access | ||
::* Coolant pressure | ::* Coolant pressure | ||
Latest revision as of 12:48, 3 January 2021
PARTCIPANTS: A. Brown, A. Camsonne, B. Wojtsekhowski, B. Sawatzky, C. Munoz-Camacho, C. Yeros, R. Ent, H. Mkrtchyan, P. Medeiros, S. Lassiter, S. Wood, V. Tadevosyan, V. Berdnikov, M. Boer, C. Hyde, H. Voskanyan
FRAME (Carlos)
- Front face: securing plate for during transportation
- PCB boards cabling: 29/31 done, should be done this week
- NPS ready to be shipped - expect shipping in early January
- Positioning: x-positioning tolerance mm scale from physics (mainly from survey), pointing of crystals to target, long target
- During crystal stacking PCBs can be inside or outside the box
- Action:
- check on access to holes to secure the box to the rails
- pressure check on frame before any crytal stacking etc. (S. Lassiter)
DSG UPDATES (Aaron)
- Fabrication of 1100 cables complete!
- Procurements almost all received
- Modeling of NPS and development of fault condition flowcharts
- different zones: electronics zone, crystal zone
- interlocks on various things to protect the system, e.g. temperature (T>18degC), humidity (>40%)
- Actions
- humidity sensor cables access
- Coolant pressure
- Working with CAEN on non-functional module replacement
ASSEMBLY SPACE - REFLECTOR AND NPS
- EEL126 planned for pre-shaping
- Main assembly should be in ESB, see Brad's drawings for space requirements
- check in with Walt's team in early January
- Discussion about strategy for crystal wrapping and installation, e.g. at the same time or wrap crystals and store until installation - continue in more detail at collaboration meeting
COLLABORATION MEETING AGENDA
- Topics seem complete, need to assign discussion leaders
- Introduction talk should be no longer than 10 minutes with at least 20 minutes for open discussion
NEXT MEETING: THURSDAY 14 JANUARY AT 9:00AM ET