View source for General Meeting Summary 9/30/21

PARTICIPANTS: Aaron Brown, Alexandre Camsonne, Arshak Asaturyan, Fernando Barbosa, Brad Sawatzky, Carlos Munoz-Camacho, Charles Hyde, Hamlet Mkrtchyan, Julie Roche, Marie Boer, Paulo Medeiros, Emmanuel Rindel, Rolf Ent, Stephen Wood, Vardan Tadevosyan, Vladimir Berdnikov, Tanja Horn


'''HV DIVIDERS''' (Fernando)

* Final tests performed, e.g. to check the baseline noise
::* noise was dominantly from darkbox - will verify with additional tests on a different dard box, but no showstopper anticipated

* Next steps progress correlated with low voltage cabling - need to add a connector to PCB, so need final decisions on that


'''LOW VOLTAGE CABLE STRATEGY''' (IJCLab-Orsay Team)

LV CONNECTOR AND CABLING
* Several different options for cabling investigated and evaluated

* Final decision: Add additional connector to PCB and add flat cables
::* Two options for the connector: pin (six pin) connector or surface mount - have identified a pin connector, but not surface mount

* '''Action items''': 
::* review connectors and identify a surface mount connector, if none available proceed with the pin connector
::* proceed with adding the connector to the PCB

ADDITIONAL GROUNDING

* Motivation for additional grounding: noise reduction
::* Electrical grounding - already have good grounding between mu metal and PMT block

* Options for adding additional grounding between mu metal tube and aluminum block PMT support
::* picoflex connector with pins (can be disconnected)
::* solder pad (permanent)

* Discussion of the grounding connectors
::* Pin solution may allow for making decision later if want to use additional grounding or not
::* On the other hand, have to make decision before assembly anyway

* Global grounding already exists - or already being worked on
::* isolate chassis from detector - i.e., overall grounded block
::* PMT blocks are already well grounded
::* internal to chassis: if good connection PMT and chassis then should be ok

* '''Action items''': 
::* Prepare scheme of global grounding scheme, general ground and localized ground 


'''MECHANICAL''' (Paulo)

* Cable layout design ongoing


'''DSG UPDATES''' (Aaron)

* Crystal thermal simulations

* No heat load applied - temperature along crystal very stable

* Applying 3.5 W heat source (18degC central crystal)
::* most heat dissipated in first 2cm
::* specifications on temperature stability and uniformity - overall stability is more important than uniformity, e.g., can tolerate few degree difference in temperature at end of crystal

* '''Action item''':
::* complete additional studies, e.g., scale up to full detector size


'''REFLECTOR PRE-SHAPING'''

* Reflector pre-shaping is taking place at two sites: ODU and JLab
::* both sites use the same shaping tools
::* Ovens and annealing procedure are slightly different
::* Initial foils prepared at ODU seem consistent with those prepared at JLab, but need to verify

* JLab oven has been used by another group on 9/29 - need to check availability of oven 

* '''Action items''':
::* ODU provide details of the annealing methods used for the initial foils for validation of the procedure
::* Find out groups that use the JLab oven


'''NEXT MEETING: THURSDAY 28 OCTOBER AT 9AM ET'''