General EEEMCal Meeting Summary 12/22/23

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PARTICIPANTS: Avishay Mizrahi, Josh Crafts, Julien Bettane, Tanja Horn, Carlos Munoz Camacho, Rosi Reed, Justin Frantz, Renee Fatemi, Sasha Bazilevsky, Or Hen, Jim Kelsey, Crytur-USA, Douglas Hasell,

MECHANICAL DESIGN (Julien)

  • Built 5x5 prototype with main goal: thermal tests (check stability of the temperature, use heated PCB to add and change power near to the crystals, validate power dissipation of the cooling, compare with ANSYS thermal model and optimize)
  • Planned beam tests: in May@CERN and/or in October@JLab. Without heated PCB used for thermal tests,
  • Requirements:
  • mecanical assembly: SiPM must be removable --> requires mechanical assembly, optical coupling with optical grease, with cooling system, with heated PCB near to the crystal
  • compatible with both zi
  • electronic: compatible with independent reading, addition with all channels reading, ASIC, fADC
  • SiPM configurations: have two options (3mm x3mm and 6mmx 6mm ) and one PCB of 18mm x 18mm
  • PCB Assembly and Calibration by blue LED
  • no optical fiber needed, radiation must be performed to ensure lifespan
  • SiPM PCB Assembly + Crystal
  • 2 MCX connectors for the "independent" reading, 1 flat cable for the "addition" with all channels
  • Fastening of the SiPM PCB assembly
  • fastening Al plate by screws
  • Overview with the MCX cables (flat cables for "addition")
  • Overview/heating PCB for thermal tests
  • fastened to the alum. plate
  • Cooling with 4 cold plates
  • water flow inside
  • Assembly
  • stacked one by one, postiion with carbon plates, fasten of SiPM+PCB with screws
  • Clearance and wrapping
  • size of the crystals at the lab: 20,5cm
  • wrapping 65um
  • tedlar 65um
  • Schedule
  • design and construction complete in March 2024


  • Cooling - how is it done?: external water cooling
  • no direct contact to crystals
  • but good contact with aluminum plate to PCB
  • for the prototype at hand assume worst case scenario
  • How is the power applied to the PCB?
  • through wattage applied to the PCB - using resistance
  • Any experience with MCX connectors?
  • No, not much experience
  • Josh thinks that caution is in order because based on his experience these wear out quickly - perhaps test for long-term stability
  • Beam test goals:
  • test if ASIC gives comparable result with fADC
  • what is the minimum energy that can be detected with both sets of electronics
  • SiPM choice will be made before beam tests with only one channel. Idea is to use only one type of SiPM for the beam test
  • SiPM pixel pitch
  • planning to make measurements for both pixel sizes and device sizes
  • need to decide by October 2024
  • Does this model have thermal simulations?
  • in general using ANSYS
  • for this particular model use general thermal calculations
  • in parallel would like to use FLUENT


SIPM/ELECTRONICS/READOUT (Justin)

  • Subset of people met with Hamamatsu (sales person, Ardavan)
  • Idea is to buy some small numbers of each 3010, 3015, 6010, 6015 and do some test bench tests with them (including irradiation)
  • for 15um plan to get enough for at least 3 crystals
  • some additional ones for 10um
  • Main difference between 3mm and 6mm is the dark current, which depends on area surface
  • SiPM irradiation plans
  • In EPIC there is a group effort to test radiation (based on Oleg's discussion at one of the recent Calo WG meetings)
  • Justin investigated UMass/Lowell - seems still available and costs are same as they have been, fission spectrum for neutrons, typical procedure: send parts to be irradiated, they irradiate to fluence desired, and send it back (possibly have to wait to cool off), cost: $4k for each part irradiated, available anytime, should take ~3 weeks turn around
  • For using neutron at UKY (10 MeV), no default setup, would need to
  • SiPMs sent to Giessen U. - tests will be done in the standard setup there, providing additional information

EIC PROJECT

  • Long lead procurement document preparation ongoing


BEAM TESTS

  • For beam tests at DESY a call will be out early next year with deadline March 2024 for beam period August - end of year 2024


NEXT MEETING: FRIDAY 26 JANUARY 2024 AT 8AM ET